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Development of a New Adhesion Promoter for Metal Adhesion on Polymer Substrates for Printed Circuit Board Production Using Functionalized Silica Nanoparticles | 689 |
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Development of a New Adhesion Promoter for Metal Adhesion on Polymer Substrates for Printed Circuit Board Production Using Functionalized Silica Nanoparticles | 7 | 7 | 13 | 9 | 10 | 9 | 3 |
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ThomasxPhDxDissertation_20160316_4.pdf | 2435 |