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Development of a New Adhesion Promoter for Metal Adhesion on Polymer Substrates for Printed Circuit Board Production Using Functionalized Silica Nanoparticles | 519 |
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Development of a New Adhesion Promoter for Metal Adhesion on Polymer Substrates for Printed Circuit Board Production Using Functionalized Silica Nanoparticles | 7 | 5 | 9 | 6 | 4 | 11 | 4 |
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ThomasxPhDxDissertation_20160316_4.pdf | 2088 |