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Development of a New Adhesion Promoter for Metal Adhesion on Polymer Substrates for Printed Circuit Board Production Using Functionalized Silica Nanoparticles | 831 |
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Development of a New Adhesion Promoter for Metal Adhesion on Polymer Substrates for Printed Circuit Board Production Using Functionalized Silica Nanoparticles | 21 | 19 | 6 | 14 | 21 | 8 | 27 |
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ThomasxPhDxDissertation_20160316_4.pdf | 2653 |