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Development of a New Adhesion Promoter for Metal Adhesion on Polymer Substrates for Printed Circuit Board Production Using Functionalized Silica Nanoparticles | 617 |
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Development of a New Adhesion Promoter for Metal Adhesion on Polymer Substrates for Printed Circuit Board Production Using Functionalized Silica Nanoparticles | 11 | 18 | 26 | 8 | 14 | 16 | 1 |
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ThomasxPhDxDissertation_20160316_4.pdf | 2339 |